Driven by rapid advances in technologies such as 5G and artificial intelligence, electronic products—including smartphones and wearable devices—are evolving toward increasingly diverse form factors and significantly more complex internal structures.
As a critical structural component, the smartphone mid-frame requires extremely stringent inspection standards for both appearance quality and auxiliary material processes.
Against the ICT industry’s relentless pursuit of product consistency and high yield rates, traditional inspection methods and conventional automation solutions often struggle with efficiency bottlenecks and high false detection rates. The market urgently requires intelligent inspection systems capable of adapting to complex manufacturing processes while delivering higher stability and accuracy—particularly for large-scale precision manufacturing.
In response, a subsidiary of Lead Intelligent Equipment (hereafter referred to as LEAD), LEADTECH, has introduced a 2D+3D defect inspection system for smartphone mid-frames centered on AOI technology. Powered by deeply integrated proprietary vision technologies, the system has been successfully deployed in appearance and auxiliary material inspection for electronic products such as smartphones, further strengthening LEAD’s leadership in high-precision industrial AOI (Automated Optical Inspection).
Technological Breakthrough
A One-Stop Solution with Full-Process Closed Loop
The newly launched system is not a conventional standalone AOI station. Instead, it is a fully integrated automated inspection system centered on AOI detection and enhanced by proprietary 2D + 3D vision capabilities, specifically customized for the complex manufacturing processes of smartphone mid-frames.
The production line integrates multiple stations—including loading, cleaning, two AOI inspection stations, and unloading—creating a complete closed-loop process from surface pre-treatment to precise defect identification.
To address the key challenges in mid-frame inspection, the system incorporates several proprietary core technologies:
Self-developed 5-axis flying capture system
Breaking conventional viewing angle limitations to enable multi-dimensional imaging without blind spots.
Multi-zone high-intensity lighting system
Designed to accurately capture microscopic defects while significantly improving imaging contrast.
Humanoid-inspired high-efficiency cleaning mechanism
Featuring a 50Hz high-speed XYZ peristaltic motion platform, effectively eliminating false detections caused by dust contamination.
Through production-line-level system integration and optimization of key process parameters, the solution has achieved industry-leading efficiency, providing strong support for customers exploring multiple technology pathways in advanced electronics manufacturing.
Proven Performance
Hard Data Demonstrates Strong Capabilities
Leveraging a mature vision architecture and an intelligent data platform, the system has demonstrated outstanding operational stability on production lines, with key performance indicators significantly surpassing the industry average.
Extreme Efficiency
Comprehensive inspection of more than 120 types of defects can be completed in just six seconds.
Precision Quality Control
The missed defect rate is controlled within 0.5%, ensuring highly reliable inspection results.
Intelligent Analysis
Combined with intelligent FA (Failure Analysis) software, the efficiency of data analysis has been doubled.
To date, LEAD has delivered multiple inspection systems to leading enterprises in the industry, helping customers establish more stable and efficient quality control systems.
Looking ahead, LEAD will continue to strengthen its technology innovation capabilities while responding rapidly to customer needs and operational challenges—supporting the ICT industry in achieving higher standards of product quality and manufacturing excellence.
