After annealing of the N-type monosilicon wafer, the single-sided PSG is removed by chain-type conveying, and then perform chemical corrosion through the trough-type method to remove the plating and PSG&BSG, and perform efficient cleaning and drying.

1. Adopt 182 transmission 6+6 and 210 transmission 5+5 compatible structure, to enhance machine stability, with little vibration or deformation, easy to maintain;
2. Customized etching trough with liquid supply rollers for thorough cleaning and over-etching reduction; Water cleaning adopts soaking+spraying+water spraying method;
3. Capacity: ≥9600 pcs/h, 10 channels 8400 pcs/tank; ≥11000 pcs/h, 10 channels 464 pcs/tank，compatible with both 210&182